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Areas of a given chip ("subcomponents") can have poor heat dissipation due to variables in the manufacturing process that produce minor differences in chips with the exact same design. Poor heat dissipation in any one area (i.e., a "hot spot") can lead to excessive thermal overload in that area, which in turn destroys the entire chip. Optimal Yield identifies such hot spots, and reduces clock speeds within the circuitry of those hot spots to mitigate destructive potential. This results in reduced chip failures and improved yields at the end of the packaging stage of the manufacturing process.